This position is no longer open for applications

Role Overview:

Design, Develop and Implement cost-effective manufacturing test solutions for complex mixed signal electronic circuit card assemblies

Role responsibilities:

• Create, debug and maintain flying probe test packages for the SPEA test platforms
• Interfacing with the new product introduction (NPI) team, provide In-Circuit Test DfT feedback
• Define testing requirements and test plans for new products, identifying best methods for PCBA testing
• Assist with PCBA defect and root cause analysis
• Technical support to Test Operators to facilitate the efficient throughput of Prime hardware during production
• Assessment of Test Equipment issues, directing support services to resolve equipment failures

Role requirements (skills, training and qualifications):

• HNC/HND (Electronics) Level of Qualifications or equivalent
• substantial level of experience in Digital and Analogue Electronics Manufacture and Test
• In depth understanding of measurement and test principles
• Knowledge of flying probe test platforms (SPEA) with experience in creating test packages
• Experience with In Circuit Test (ICT) methodologies
• Knowledge of Boundary Scan test methods
• Communication skills; the ability to communicate both verbally and in writing
• Analytical and problem-solving skills.